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Semiconductor Packaging: Materials Interaction and Reliability Cover Image
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Handbook of Package Engineering Cover Image
$375.00
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Biodegradable Composites for Packaging Applications Cover Image
By Arbind Prasad (Editor), Ashwani Kumar (Editor), Kishor Kumar Gajrani (Editor)
$200.00
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Food Packaging Science and Technology Cover Image
$160.00
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Plastics Packaging 3e: Properties, Processing, Applications, and Regulations Cover Image
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Packaging Logistics: Understanding and Managing the Economic and Environmental Impacts of Packaging in Supply Chains Cover Image
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Embedded Dielectrics for Electronic Packaging Cover Image
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Industrial Design Cover Image
$13.99
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Cooling of Microelectronic and Nanoelectronic Equipment Cover Image
$170.00
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The Design-Inspired Innovation Workbook Cover Image
$88.00
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Design and Modeling for 3D ICS and Interposers Cover Image
$137.00
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Food Packaging: Advanced Materials, Technologies, and Innovations Cover Image
$180.00
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