3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization Cover Image

By Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz

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Product Details
ISBN: 9783030982317
ISBN-10: 3030982319
Publisher: Springer
Publication Date: June 29th, 2023
Pages: 395
Language: English

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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization (Paperback)

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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization (Paperback)

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